JPH0288282U - - Google Patents
Info
- Publication number
- JPH0288282U JPH0288282U JP16809088U JP16809088U JPH0288282U JP H0288282 U JPH0288282 U JP H0288282U JP 16809088 U JP16809088 U JP 16809088U JP 16809088 U JP16809088 U JP 16809088U JP H0288282 U JPH0288282 U JP H0288282U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- case
- metal board
- board
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16809088U JPH0288282U (en]) | 1988-12-26 | 1988-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16809088U JPH0288282U (en]) | 1988-12-26 | 1988-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0288282U true JPH0288282U (en]) | 1990-07-12 |
Family
ID=31456963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16809088U Pending JPH0288282U (en]) | 1988-12-26 | 1988-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0288282U (en]) |
-
1988
- 1988-12-26 JP JP16809088U patent/JPH0288282U/ja active Pending